• Full Paper Submission:   January 31st   February 10th  
  February 20th, 2023   (Final Deadline)

• Notification of Acceptance:   March 15th, 2023

• Final Paper Submission:   April 5th, 2023

Step 1: Templates

Authors are invited to submit a 2- to 4-page camera-ready manuscript formatted according to the official IEEE templates for conference proceedings. The manuscript file must be in PDF format (other formats or hard copies will not be accepted). The workshop’s official language is English.


Step 2: Submission

The submission of papers will be managed through EasyChair online conference management. Authors that never used this platform previously will need to create an account. To submit a paper, login to the IEEE SPI 2023 submission webpage and choose New Submission. Successful submissions will receive a confirmation e-mail with subject IEEE SPI 2023 submission [number]. Changes and updates can be made until the Full Paper Submission Deadline.


After the Notification of Acceptance

Authors will need to check their Final Paper using IEEE PDF eXpress® and comply with the IEEE Electronic Copyright Form (eCF) (detailed information has been sent in the Notification and Proceedings emails).

Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore® (subject to meeting scope and quality requirements for IEEE Xplore®)

➤ Authors of the best ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology

IEEE reserves the right to exclude a paper from distribution after the workshop (including IEEE Xplore® Digital Library) if the paper is not presented by the Author at the workshop.


• Only accepted papers with fully paid registrations (Senior or Student) until April 5th, 2023 will be included in the workshop’s program and submitted for inclusion into IEEE Xplore®.
• Each registered Author is allowed to present one (1) paper during the workshop.