Student Awards

	Student Travel Grants
The IEEE Electronics Packaging Society, a SPI 2023 Sponsor, is pleased to provide a special Travel Grant to two (2) students making a presentation at the workshop. The Grants are intended to support all costs directly tied to the event’s attendance, with reimbursements up to the limits of € 1300 for students from European institutions and € 2100 for students from non-European institutions.

Congratulations to Federico Garbuglia (Ghent University – imec, Belgium)

Congratulations to Antonio Carlucci (Politecnico di Torino, Italy)

 

	Best Student Paper
The SPI Best Student Paper award recognizes excellence in research for papers authored and presented by a student at the workshop.

Congratulations to Antonio Carlucci (Politecnico di Torino, Italy)

 

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Rules and Procedures

Eligibility

To be eligible, the applicants must meet the following criteria:
• Be enrolled in a recognized academic graduate degree program (Masters or Doctoral)
• Be the presenting author of an accepted paper (oral or poster)

How to apply

Until March 31^st, 2023, the applicants must send an e-mail to the workshop Secretariat with the subject Student Awards Application and the following information:
• Applicant’s full name
• Title of the accepted paper
• Nomination letter (PDF format, 1-page max.) from the applicant’s advisor or a professor, certifying that the accepted paper is primarily the student’s work

Winners selection

During the workshop, the jury panel will attend each applicant’s presentation (orals and posters). The quality of the presentation, the clarity in replying to questions from the audience and the evaluation made during the review process will be taken into account to select the Awards winners.

Information for winners

The Awards can be cumulative. Instructions to request the Travel Grant’s reimbursements will be provided after the workshop ends.