The IBIS Open Forum is pleased to announce a hybrid virtual/in-person IBIS Summit meeting following the 27th IEEE Workshop on Signal and Power Integrity (SPI 2023) on Wednesday, May 10, 2023. This is the 25th IBIS Summit associated with events in Europe.
This IBIS Summit is intended to promote exchange of ideas and methods among users and developers of IBIS models as well as the IEEE EPS and EMC Society members. Those interested in presenting at or attending the event may register using the information below. We encourage IBIS Summit participants to also attend the IEEE SPI 2023.
The meeting is free and open to everyone. We look forward to seeing you either online or in Aveiro!
Randy Wolff
Chair, IBIS Open Forum
First Call for Participants
| Date | Wednesday, May 10, 2023 |
| Time | 14:00 – 18:00 WEST (UTC+1) 15:00 – 19:00 CEST (UTC+2) 9:00 am – 1:00 pm EDT (UTC-4) 6:00 am – 10:00 am PDT (UTC-7) |
| Location | IEEE SPI 2023 venue Online |
| Content | Presentations and Discussions |
| Cost | Free |
| Sponsors | IBIS Open Forum |
People involved in IBIS or related signal integrity and/or power integrity model development or EDA tool development as well as the IEEE EPS and EMC Society members and IEEE SPI 2023 attendees are invited to participate. If you plan to participate, please register with the information below:
| Name: | |
| E-mail address: | |
| Company: | |
| Participation: | In-person / Online |
| Send to: | Lance Wang (lance.wang@ibis.org) |
| Deadline: | Monday, May 8, 2023 |
Call for Presentations
We are seeking presentations from individuals who have experiences of interest to the IBIS modeling community. Presentations may be addressed to any and all levels of IBIS experience, from beginner to expert, and can include, but are not limited to:
• Demonstrations of modeling techniques
• Explanations of behavioral algorithms
• Descriptions of difficulties encountered
• Model correlation
• Modeling building experiences
• Comparisons to other modeling methods
• New technologies for modeling buffers and components
• New technologies for modeling packaging and interconnects
• Algorithmic modeling topics
• Ideas for IBIS model users
• Signal and/or Power Integrity modeling
Electronic Archival: We require electronic versions of all presentations, that will be shared during the meeting, archived on the IBIS website and made available to non-attendees. The preferred formats are Microsoft PowerPoint or Adobe PDF.
If you plan to make a presentation, please send it until the deadline for processing and brief review, alongside the following information:
| Title: | |
| Presenter: | |
| E-mail address: | |
| Company: | |
| Estimated Time Required: | Usually 15 to 45 minutes (allow time for questions) |
| Send to: | Lance Wang (lance.wang@ibis.org) |
| Deadline: | Wednesday, April 26, 2023 |
All submissions will be reviewed by the IBIS Board and are subject to approval before presentation at the Summit. The IBIS Open Forum reserves the right to reject submitted presentations or stop a scheduled presentation containing content that has not been reviewed. Please note that vendor-specific, confidential or product promotion material is forbidden at IBIS summits.