IMPORTANT
DATES
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• Full Paper Submission: January 31st February 10th
February 20th, 2023 (Final Deadline)
• Notification of Acceptance: March 15th, 2023
• Final Paper Submission: April 5th, 2023 |
The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. All contributions will undergo a rigorous review process, conducted by the TPC. Instructions for manuscript submission are available in the Submissions menu.
➤ Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore® (subject to meeting scope and quality requirements for IEEE Xplore®)
➤ Authors of the best ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology
TOPICS:
• Modeling and simulation for SI/PI
• Coupled signal and power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/ sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design |
SPI 2023 Call for Papers
(PDF file for download)
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