Call for Papers


• Full Paper Submission:   January 31st   February 10th  
  February 20th, 2023   (Final Deadline)

• Notification of Acceptance:   March 15th, 2023

• Final Paper Submission:   April 5th, 2023


The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. All contributions will undergo a rigorous review process, conducted by the TPC. Instructions for manuscript submission are available in the Submissions menu.

Accepted papers will be included in the workshop’s program and submitted for inclusion into IEEE Xplore® (subject to meeting scope and quality requirements for IEEE Xplore®)

➤ Authors of the best ranked accepted papers will have the opportunity to submit an extended version of their work for publication in a special section of the IEEE Transactions on Components, Packaging and Manufacturing Technology


• Modeling and simulation for SI/PI
• Coupled signal and power Integrity analysis
• Noise reduction and equalization techniques
• High-speed link design and modeling
• Power distribution networks
• RF/microwave/mm-wave systems and packaging solutions
• Antennas-in-package and antennas-on-chip
• 3D IC and packages (TSV/SiP/SoC)
• Nano-interconnects and nano-structures
• Electromagnetic theory and modeling
• Transmission line theory and modeling
• Macromodeling, reduced order models
• Electromagnetic compatibility
• Design methodology/flow measurements
• Jitter and noise modeling
• Stochastic/ sensitivity analysis
• Electro-thermal modeling
• Chip-package co-design
• Novel CAD concepts
• Optical interconnects
• AI in electronics design

SPI 2023 Call for Papers
(PDF file for download)